Waddan Systems provides the total processing solutions for wafers up to 100mm
in diameter. Our oxidation and diffusion furnaces can handle up to
100 wafers per run with less than
| WAFER DIAMETER(SIZE) | 2", 3", 4" |
| MATERIAL | silicon, Pyrex, quartz, lithium niobate,alumia, SiC, GaAS etc. |
| POLISHED FACES | Single Side Polished (SSP), Double Side Polished (DSP) |
| PHOTOLITHOGRAPHY | Positive and Negative |
| DICING | Diamond Resin blade to dice hard material like alumina |
| LASER TRIMMING | Trimming inside a sealed cavity |
| SPUTTERING | Inert gas ions dislodge target materials & deposit on wafers |
| THIN FILM DEPOSITION | CVD, Evaporation and low temp ( |
| OXIDE GROWTH | Thermal oxidation of substrate surfaces at elevated temp |
| ELECTROPLATING | Various metals |
| ELECTROLESS PLATING | Dipping in PH balanced baths for Nickel & Gold plating |
| DIFFUSION | Phosphorous/Boron |
| RINSING/DRYING | DI water rinse to 14 mega ohms |
| BALL WEDGE BONDING | Gold wire interconnects between devices and circuit pads |
