These Dicing Saws are part of the desktop processing equipment for dicing wafers to separate the individual devices. These are part of development equipment of a MEMS Research Lab for quick testing of devices under development. Both saws are in excellent condition, while one saw is in use, the other goes for maintenance and storage.

These Dicing Saws are employed for precision dicing, cutting and scribing of wafers. They have been routinely used with materials such as Silicon, Pyrex, Quartz, Alumina, Lithium Niobate etc. Dicing wheels with diamond impregnated resin can handle hard heat producing materials with proper cooling flows.

Perfect for a startup or university with technical skills to take some technical responsibility and save money over buying new.

Features