This eutectic die bonder is a desktop processing equipment for die bonding for hybrid chip packaging. This is part of development equipment of a MEMS Research Lab for quick testing of devices under development. The bonder is in excellent condition looks almost new despite its age.
Power Requirement: 115 VAC, 50/60Hz, 3 Amp
Brand: Mech-El Model 709
Heated Work Holder
6:1 Micro-positioner
Binocular Microscope
Sr No. 5530
Perfect for a startup or university with technical skills to take some technical responsibility
and save money over buying new.
It is available for inspection by appointments
Pricing negotiable. Make Offers.
