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A MICRO/NANO SENSORS & SYSTEMS COMPANY
|   Hughes Ball & Wedge Gold Wire Bonders   |
|   (Ultrasonic Thermocompression Process with Heated Work Holder)   |

   (Sale Unit SU72-05)   


CONDITION

These wire bonders are the desktop processing equipment for gold wire ball and wedge bonding. These are part of development equipment of a MEMS Research Lab for quick testing of devices under development. (These are employed for IC Chip packaging) Both are in excellent condition, while one bonder is in use, the other goes to maintenance and storage.

Perfect for a startup or university with technical skills to take some technical responsibility and save money over buying new.

Spares:

  7 Spools of Gold Bonding Wires of wire (different dia.)
  Bonder cappilliary Feeds;
  Tungsten Rod Wire for cleaning cappilliary jams ;
  Heat resistant and repair parts.

They are available for inspection by appointments.

Pricing negotiable. Make Offers.

EQUIPMENT PHOTOS

Wire Bonder # 1

Bonder with Binocular Microscope

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Heated Bonding Stage

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Rear Right Exposed View

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Rear View Exposed

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Rear Left Exposed

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Rear View

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Front Right Control Switches

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Front Left Controls

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Logo

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Wire Bonder # 2

Front Binocular Microscope View 1

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Front Binocular Microscope View 2

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Wire melter for making ball

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Front Left Controls

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Front Right Controls

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Logo

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Bonding Mechanism without Stage

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Wire Spool with Feeder

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Rear View 1

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Rear View 2

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Rear Exposed View

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Rear Left Exposed

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