These wire bonders are the desktop processing equipment for gold wire ball and wedge bonding. These are part of development equipment of a MEMS Research Lab for quick testing of devices under development. (These are employed for IC Chip packaging) Both are in excellent condition, while one bonder is in use, the other goes to maintenance and storage.
Perfect for a startup or university with technical skills to take some technical responsibility
and save money over buying new.
7 Spools of Gold Bonding Wires of wire (different dia.)
Bonder cappilliary Feeds;
Tungsten Rod Wire for cleaning cappilliary jams ;
Heat resistant and repair parts.
They are available for inspection by appointments.
Pricing negotiable. Make Offers.
