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A MICRO/NANO SENSORS & SYSTEMS COMPANY
|   Wafer Fabrication Services    |
Waddan Systems provides the total processing solutions for wafers up to 100mm in diameter.  Our oxidation and diffusion furnaces can handle up to 100 wafers per run with less than 0.1 °C  temperature variation from end to end wafers.
WAFER DIAMETER(SIZE)2", 3", 4"
MATERIALsilicon, Pyrex, quartz, lithium niobate,alumia, SiC, GaAS etc.
POLISHED FACESSingle Side Polished (SSP),   Double Side Polished (DSP)
PHOTOLITHOGRAPHYPositive and Negative
DICINGDiamond Resin blade to dice hard material like alumina
LASER TRIMMINGTrimming inside a sealed cavity
SPUTTERINGInert gas ions dislodge target materials & deposit on wafers
THIN FILM DEPOSITIONCVD, Evaporation and low temp (200 °C to 350 °C) Plasma Enhanced Chemical Vapour Deposition (PECVD)
OXIDE GROWTHThermal oxidation of substrate surfaces at elevated temp
ELECTROPLATING Various metals
ELECTROLESS PLATINGDipping in PH balanced baths for Nickel & Gold plating
DIFFUSIONPhosphorous/Boron
RINSING/DRYINGDI water rinse to 14 mega ohms
BALL WEDGE BONDINGGold wire interconnects between devices and circuit pads


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